Solid State Technology/Advanced Packaging:
The leading magazine for the Semiconductor manufacturing industry & packaging.

Solid State Technology/Advanced Packaging magazine is the longest-running semiconductor magazine and is the most complete source of information for the semiconductor & semiconductor packaging manufacturing industry. Each issue covers the latest on semiconductor business news and products with topics such as nanotechnology, semiconductor equipment, wafer processing, packaging design, IC packaging, packaging technology and other issues important to professionals in the business of semiconductor manufacturing.

Subscribe to Solid State Technology/Advanced Packaging magazine and newsletters today to receive the latest information on: Wafer Processing/Cleaning Nanotechnology Deposition MEMS Etch Metrology Lithography PV/Solar Gases/Gas Handling Automation   Packaging Design Sockets Flip Chip Test & Inspection Wire Bonding Cleaning Wafer-level Packaging

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1. Your principal job function: (Check ONE number below)

	General/Corporate Management
	Wafer-Fab Processing/Production
	Process Development
	Packaging Assembly
	Production Equipment Manufacturing
	Reliability, Quality Control, Evaluation, Testing
	Design
	Research & Development
	Engineering Support
	Plant/Facilities/Maintenance Engineering
	Purchasing
	Manufacturing or Engineering Management
	Other (Please Specify)

2. Your company or organization: (Check ONE number below)

	Merchant/Captive Manufacturers
	Foundries
	Consortiums
	R&D and Manufacturing of Semicondoctors, ICs, Hybrid Circuits, Custom ICs, Semicustom ICs or ASICs
	Semiconductor Manufacturing Equipment/Test Equipment
	Basic Semiconductor Chemicals, Gases or Materials Manufacturing
	IC Packaging or Semiconductor Packaging
	Independent Research & Development Lab (not associated with a manufacturer)
	Government & Military
	Educational Institutions
	Non-Semiconductor Products Manufacturing Using Thin-Film Technologies
	Other Allied to the Field

3. As part of my responsibilities: (check ALL that apply)

I manage or supervise a department or larger organization
I manage or supervise a project team
I manage or supervise one or more projects
Other management or supervisory responsibility
None of the Above

4. I authorize, influence, specify or buy the following products ? (check all that apply) 

Chemicals
Chemical Delivery
Thin Film Materials
Wafers/Substrates
Packaging Material

B. Gases/Gas Handling

Gases
Gas Filters/Cabinets/Panels
Mass Flow Controllers

C. Lithography

Photomasks/Mask Aligners
Mask/Reticle Manufacturing Equipment
Photoresist Processing: (Coat, Develop, Bake, Strip)
Photoresists
Positioning Equipment
Wafer Steppers & Scanners

D. Thermal Processing/Implant

Thermal: Annealing, RTP, Laser, E-Beam
Furnaces/Diffusion/Oxidation Equipment
Ion Implanters

E. Deposition

Chemical Vapor Deposition Equipment
Sputtering (PVD)/Electroplating Systems

F. Etching/Planarization

CMP Equipment
Plasma Etch
Wet Chemical Processing

G. Packaging/Assembly

Bonding: Wire, Die, Tab
Dicing, Scribing and Die Separation
Packaging, Encapsulating, Sealing
Flipchip/BGA Process Equipment

Defect Inspection/Failure Analysis
In-situ and In-line Monitoring
Measurement Systems: Film Thickness, Flatness, Contamination, Stress
Microscopes: Optical
Microscopes: Non-optical
Patterned Wafer Inspection/CD Measurement
Testers (Parametric and Functional)/Probes

I. Contamination Control

Contamination Control Products
Static/Vibration Control Equipment

J. Vacuum Equipment

Pumps
Residual Gas Analyzers
Vacuum Components (Bellows, Chambers, Guages, Valves, etc.)

K. Automation/Wafer Handling

Intrabay/Interbay Automation
Robotics
Wafer Cassettes, Boats
Diagnostic Software
Fab Automation Software
Yield Management Software
Machine Vision

L. Allied Technologies

Compound Semiconductors
MEMS
Nanotechnology
FPDs
Photovoltaics

None of the products listed in sections A thru L above

5. Please indicate the number of employees at your company: (Check ONE number below)

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